Dennis (Hoi Kwan) Cheung, partner of UPSOP, is interested in innovative structures and novel techniques of fabrication and construction. Trained as a maker, he believes that good designs resolve problems of the built environment as well as constantly push the boundary of the architectural industry. Dennis received a Bachelor of Arts in Architectural Studies from the University of Hong Kong where he graduated with first class honours, and a Master of Architecture from Massachusetts Institute of Technology. He was awarded the MIT Department of Architecture Merit Award twice and the KPF Travelling Fellowship Honorable Mention in 2012 for his artistic vision and commitment to the broad social aims of architectural design. He has worked in the offices of C+S Architects of Treviso, Italy; Kengo Kuma & Associates of Tokyo, Japan and Beijing, China respectively; CL3 Architects and Leigh & Orange Architects of Hong Kong.
Dennis currently lives and works in Hong Kong. He welcomes any forms of collaboration in shaping Hong Kong a better city.
CL3 Architects, Hong Kong, HK, Architectural Designer
CL3 Architects, Hong Kong, HK, Architectural Designer
MIT International Science & Technology Initiatives Fund, Grant
MIT Department of Architecture Merit Award, Scholarship
MIT Department of Architecture Merit Award, Scholarship
MIT Graduate Fellowship, Scholarship
Dean’s Honours List, Award
Sola Gratia Academic Fund, Grant
Worldwide Student Exchange Scholarship, Scholarship
Dean’s Honours List, Award
Dean’s Honours List, Award
